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Diamond & CBN Grinding Wheel Calculator

An open-source calculator for selecting and checking basic parameters for diamond and CBN grinding wheels.

Supported:

  • Diamond wheels
  • CBN wheels
  • Vitrified bond
  • Resin bond
  • Metal bond

Live Demo

Launch the Grinding Wheel Specification Generator

No installation or build tools are required. The generator runs directly in a modern web browser.

Overview

This tool helps grinding engineers and machinists quickly verify wheel parameters, surface speeds, and recommended grinding conditions for diamond and CBN (Cubic Boron Nitride) superabrasive wheels.

It is not a replacement for manufacturer data sheets or process engineering judgment — it provides first-order estimates to guide setup and catch common mistakes.

Features

  • Surface Speed Calculation — converts wheel diameter and RPM to m/s and ft/min
  • Recommended Parameters — depth of cut, table speed, RPM limits based on bond type and workpiece hardness
  • Basic Grinding Outputs — MRR (Material Removal Rate), grinding power, G-ratio, chip thickness
  • Wheel Volume & Weight — estimated from bore, OD, width, and bond density
  • Safety Warnings — alerts for overspeed, wrong abrasive-material pairing, and dry grinding risks

Key Formulas

Surface Speed (m/s) = π × D(m) × RPM / 60

MRR (cm³/min) = Depth of Cut(mm) × Width(mm) × Table Speed(m/min) / 1000

Grinding Power (kW) = MRR × Specific Energy / (60 × 1000)

Usage

Open index.html in any modern browser. No server or build step required.

Bond Type Speed Limits

Bond Max Surface Speed Source / Reference
Resin Bond 35 m/s Resin bond wheels typically rated 25–50 m/s; 35 m/s is a common conservative limit. — Norton Grinding Wheel Catalogue; Saint-Gobain Abrasives Technical Reference
Vitrified Bond 60 m/s Vitrified bond wheels rated up to 60–80 m/s depending on grade and reinforcement. — Winterthur Technology Group Technical Manual; Kellenberger grinding specifications
Metal Bond 25 m/s Metal bond wheels limited by bond strength and heat generation; 20–30 m/s typical. — EHWA Diamond Technical Guide; Asahi Diamond Industrial Co.
Electroplated 40 m/s Single-layer electroplated wheels limited by nickel bond adhesion; 30–50 m/s typical. — Dr. Kaiser Diamantwerkzeuge Catalogue; Engis Corp. Technical Notes

Material–Abrasive Compatibility

Material Recommended Abrasive Source / Reference
Steel (Carbon / Alloy) CBN Diamond dissolves in iron at grinding temperatures. CBN is the standard for ferrous materials. — Malkin & Conring, "Grinding Technology: Theory and Practice of Cutting and Grinding", Industrial Press
Stainless Steel CBN Same iron-reactivity issue as carbon steel. — Malkin & Conring; Sandvik Coromant Grinding Handbook
Cast Iron Diamond Graphite flakes make cast iron non-reactive to diamond. — Malkin & Conring; Norton Abrasives Application Guide
Hardened Steel (>45 HRC) CBN CBN retains hardness at high temperatures; preferred for hardened ferrous. — Malkin & Conring; Schmitt Superabrasives Technical Bulletin
Tungsten Carbide Diamond Diamond is the standard for cemented carbide grinding. — Sandvik Coromant; Kennametal Grinding Guidelines
Technical Ceramic Diamond Ceramics are extremely hard; only diamond has sufficient hardness. — Malkin & Conring; 3M Superabrasives Guide
Glass / Quartz Diamond Standard industrial practice. — Norton / Saint-Gobain Abrasives; Schott AG Processing Guidelines
Silicon / Semiconductor Diamond Silicon wafer dicing and grinding use diamond exclusively. — Disco Corporation Technical Manual; Applied Materials Grinding Notes
Titanium / Superalloy CBN Titanium is chemically reactive with diamond at high temps; CBN preferred. — Malkin & Conring; GE Superabrasives Application Notes
PTFE / Composites Either Low hardness; both abrasive types work. Coarse grit preferred. — Composites Manufacturing Association Guidelines; Engis Technical Notes

Specific Energy Values

Material Specific Energy (J/mm³) Source / Reference
Steel (Carbon / Alloy) 60 Typical range 40–80 J/mm³ for steel grinding. — Malkin & Conring, Table 3.2; Rowe, "Principles of Modern Grinding Technology", Springer
Stainless Steel 70 Higher than carbon steel due to work hardening tendency. — Malkin & Conring; Sandvik Grinding Handbook
Cast Iron 30 Lower due to graphite flake lubrication and brittleness. — Malkin & Conring; Rowe
Hardened Steel 80 Harder materials require more energy per unit volume removed. — Malkin & Conring; Rowe
Tungsten Carbide 100 Very hard material; high specific energy. — Malkin & Conring; Schmitt Superabrasives
Technical Ceramic 120 Extremely high specific energy due to hardness and brittleness. — Malkin & Conring; Rowe
Glass 90 Brittle fracture dominates; moderate specific energy. — Malkin & Conring; Moore "Precision Grinding"
Silicon 110 Brittle semiconductor; high energy to remove material. — Disco Corporation; Bridging published wafer grinding data
Titanium 75 Reactive and tough; moderate-high energy. — Malkin & Conring; GE Superabrasives
PTFE / Composites 5 Very soft; low energy. — Engis Technical Notes; composite machining references

Usage

Open index.html in any modern browser. No server or build step required.


Disclaimer: Typical reference values only. Always follow the wheel manufacturer's marked maximum operating speed and applicable safety standards.

About the Project

This open-source project provides basic calculation tools and technical references for diamond and CBN grinding applications.

Developed and maintained by SINOGRIND.

Website: https://sinogrind.com/

License

MIT